Nagajima S (1989) TPM development program. Lizaranzu MJM, Rojo FC (2012) Equipment utilization tracking and improvement in semiconductor industry in probe and final test areas. In: 2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 international symposium on semiconductor manufacturing (ISSM) (pp 1–5). Lee M, Lin HC, Peng CN, Wang MJ (2015) Novel adaptive probing for wafer level chip scale package. Jang C, Park S, Infantolino B, Lehman L, Morgan R, Sengupta D (2008) Failure analysis of contact probe pins for SnPb and Sn applications. In: Transactions on components and packaging technologies, Vol 31, No 1 (pp 196–203) In: 2014 International test conference (pp 1–6), IEEEĭe-Shin L, Meng-Kae S, Fang-Mao Z (2008) An investigation of wafer probe needles mechanical properties and contact resistance changing under multiprobing process. J Mater Process Technol 103(1):149–154Ĭhen H, Lin HC, Peng CN, Wang MJ (2014) Wafer level chip scale package copper pillar probing. IEEEĬhand G, Shirvani B (2000) Implementation of TPM in cellular manufacturing. In: Proceedings International Test Conference 2000 (IEEE Cat. J Q Mainten Eng 9(3):223–238īroz JJ, Andersen JC, Rincon RM (2000) Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning. Meet the different needs of customers and can be customized.Bamber CJ, Castka P, Sharp JM, Motara Y (2003) Cross-functional team working for overall equipment effectiveness (OEE). Screw thread type: Products with special specifications. Solder cup type: Suitable for Cable end, easy to solder with wire. Provide designers with more choices in space utilization.ĭouble head type: The double head double action design allows engineers to have more space flexibility in the two-way connection of the board to the board. SMT type: high stability, flat bottom design, easier to solder with PCB board.ĭIP type: This Pogo pin type has a positioning pin at the tail, which will not offset during welding, and the positioning is good. The advantages of the six Pogo pin types: Through hole structure: It is a good choice for small-sized Pogo pin connectors, which can meet customer's demand for elastic force in small size. Inclined surface plus ball structure: high current, small contact resistance, stable performance.ĭouble contact structure: The spring is directly set on the end of the plunger, and the plunger is stressed vertically, so the deflection of the plunger is relatively small. Inclined surface structure: The resistance value is small and stable, which can ensure that the plunger is in close contact with the barrel and reduce the probability of instantaneous power failure. The advantages of the four Pogo pin structures: And six types: SMT type, DIP type, right angle type, double head type, solder cup type and screw thread type. Pogo pin is generally divided into four structures: inclined surface structure, inclined surface plus ball, double contact structure and through-hole structure. The surface of the Pogo pin is generally gold plated to better enhance its anti-corrosion function, mechanical properties, electrical properties, etc. Choosing different Pogo pin for different needs.
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